The PCI asynchronous reconstruction method of intel440BX
Cautions
- this gentleman method is a method which I performed. It is O.K. if there is an independently easy method.
- Although written by the method which used 74AS04, you may carry out by TTL of a different number.
- When the series of TTL differs, it may not operate or may be made to be said that PCI apparatus may be damaged.
- this gentleman method may not be fit for set resistance.
- Even if the figure is wrong, since responsibility cannot be taken, please be sure to manufacture it, seeing a data book.
- Seemingly, it will be better to have inserted the diode into the power supply of the device of 5V, and to use it by 4.5V place.
- There is a page of a reason which attaches the diode with which Mr. ROBIN was written.
Mr. kei's page has description of the reconstruction containing a photograph. Please have a look to reference.
Mr. EC converted from Mr. EC. I received the reconstruction photograph of Iwill DBD100.
- Photograph 1 ... It is said that a substrate is made into 2 stories and the oscillator etc. was attached.
- Photograph 2 ... It is said that FAN was attached to CPU of not SECC but PPGA since it interfered in the heat sink.
Reference circuit diagram

Seemingly, it will be better to have attached the diode and to be used by having lowered 5V to about [ 4.5V ], since the output of 74AS04 should have broken PCI apparatus. Behind a diode, let's attach an about 100-micro F electrolysis capacitor.

If TTL is set to 74LCX04 and the power supply of TTL is taken from 3.3V to reference, that whose oscillator is 5V can also be used, without attaching a diode.

Although the leg of TTL is opened at the time of purchase, this is bent by hand and it closes it. (It seems to have seen a picture from the side)
The leg of 1, 3, 5, 9, 11, and 13 of 74AS04 is further bent, as shown in the left figure, and as shown in the right figure, it connects by the tinning line. The pin which was not bent cuts the point of a leg and performs solder. (It seems to have seen a picture from the back)
A laminating ceramic condenser is soldered to the leg of the oscillator of crystal. (It seems to have seen a picture from the back)
It solders in accordance with the No. 1 pin of the oscillator of crystal, and TTL. (It seems to have seen a picture from the side)
On a main board, the resistance (about 7-9 pieces) connected to PCI relation output of IC of PLL which builds FSB and PCI clock is removed. (220 of resistance changes with main boards.)
A pattern is cleaned after removing resistance.
A lead is attached in one side of the removed tip resistance.
The opposite side of tip resistance is soldered to a substrate.
The opposite side of the lead which attached tip resistance is soldered to the leg of 74AS04. Since there is 7-9 PCI, several places are connected to one leg two lines. However, the system which is not performed into PCI slots, such as PCI CLK_F, is connected independently. Connection of a power supply and GND is also made simultaneously. (It seems to have seen a picture from the side)